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External Affairs Ministry Plans To Issue Chip-Based E-Passports


The ministry of external affairs is planning to issue chip-enabled e-passports that will have advanced security capabilities. In such passports, the physical passport will include personal details of the individual that will be digitally signed and recorded in the chip.
And in case of tampering, the system will be able to identify and thus its authentication will be failed. Also, it will save on the process of immigration and as only few seconds will be taken in reading the details.

External Affairs Ministry Plans To Issue Chip-Based E-Passports

In the Rajya Sabha recently, it has been informed that already a go-ahead has been given for procuring electronic contactless inlays that will be needed for manufacturing of e-passports to India Security Press (ISP) Nasik. Once the tendering and procurementprocess is through, the e-passport manufacturing will commence.

Other details on e-passport that you should know:

1. These will bear a thicker front and back cover
2. In the back cover, there will be embedded the chip that will be silicon based
3. The chip has a size smaller than a postage stamp
4. A memory space of 64 kilobytes is there in the chip
5. Data of a maximum of 30 international trips will be stored in the chip.

Read more about: passport
Story first published: Saturday, July 20, 2019, 15:50 [IST]
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