Advanced semiconductor packaging in India as Paras Semiconductors partners BroadPak

Paras Semiconductors, which sits under Paras Defence and Space Technologies, announced a technology partnership with US firm BroadPak Corporation. The plan focuses on building advanced semiconductor packaging capacity in India. The companies said the tie-up aims to support new needs in AI, data centres, and strategic electronics.

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Under the agreement, Paras Semiconductors said it plans an OSAT facility in India. The unit is set to handle advanced heterogeneous integration and 3D packaging work. The company said this site is intended to cover both large-scale production and specialised electronics requirements.

Semiconductor packaging partnership aims to build OSAT facility in India

The proposed unit is expected to work on 2.5D/3D packaging and chiplet integration. It will also cover hybrid bonding and fan-out packaging at wafer and panel levels. The company added co-packaged optics, plus testing and qualification, as part of the planned scope.

The facility is aimed at products used in optical and optronic systems. The company also listed high-performance computing, networking, and data centres as target areas. It said the site would also serve strategic electronics needs alongside high-volume manufacturing.

Semiconductor packaging partnership includes BroadPak technology transfer and IP access

Paras Semiconductors said it will get access to BroadPaks intellectual property for design, manufacturing, and integration. The company added that the arrangement includes technology transfer and process know-how. Both sides also plan to work on packaging platforms for AI and high-performance computing uses.

The two firms also said they will work together on training Indian engineers. BroadPak is based in San Jose, California, and was founded in 2007. The release said BroadPak brings specialised skills in advanced packaging design, manufacturing, and system integration.

Semiconductor packaging partnership linked to India AI and data centres needs

"Our entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical to Indias AI and data centres and industrial capabilities,\" Munjal Sharad Shah, Managing Director, Paras Defence and Space Technologies, said.

Paras Semiconductors CEO Santosh Kumar said the company wants a packaging platform for next-generation use cases. Santosh Kumar said the focus is on performance, connectivity, and thermal demands. BroadPak Founder and CEO Farhang Yazdani said India offers a key opening for heterogeneous integration and system-level packaging.

The companies said the partnership is set to combine Paras Semiconductors’ local plans with BroadPak’s experience in advanced packaging. The focus areas include 3D integration work, chiplet approaches, and related testing steps. The release said the project is intended to support India’s expanding semiconductor ecosystem and electronics requirements.

With inputs from PTI